Keynote

Tutorial

Lecture

T1: Device Structures & Fabrication Techniques
Chair: Prof. W. Saito, Kyushu University, Japan; Vice-chair: Prof. K. Hasegawa, Kyushu Institute of Technology, Japan
T2: Device Characterization & Modeling I
Chair: Prof. K. Hasegawa, Kyushu Institute of Technology, Japan; Vice-chair: Prof. W. Saito, Kyushu University, Japan
T3: Device Characterization & Modeling II
Chair: Prof. F. Richardeau, Laplace Laboratory – University of Toulouse – CNRS, France; Vice-chair: Dr. L. Maresca, University of Naples Federico II, Italy
F1: Applications I
Chair: Prof. J. Imaoka, Nagoya University, Japan; Vice-chair: Dr. E. Gurpinar, Oak Ridge National Lab, USA
F2: Packaging & Passives
Chair: Dr. K. Saito, Hitachi Power Semiconductor Device Ltd., Japan; Vice-chair: Dr. A. Catalano, University of Naples Federico II, Italy
F3: Applications II
Chair: Dr. E. Gurpinar, Oak Ridge National Lab, USA; Vice-chair: Prof. J. Imaoka, Nagoya University, Japan
F4: Harsh Environments & SOA
Chair: Dr. L. Maresca, University of Naples Federico II, Italy; Vice-chair: Prof. A. Castellazzi, Kyoto University of Advanced Science, Japan

Poster

T3-PD: Devices
Chairs: Dr. L. Maresca, University of Naples Federico II, Italy; Prof. F. Richardeau, Laplace Laboratory – University of Toulouse – CNRS, France
T3-PA: Applications
Chairs: Prof. J. Itoh, Nagaoka University of Technology, Japan; Prof. T. Sato, Kyoto University, Japan
F3-PP: Packaging & Integration
Chairs: Dr. A. Catalano, University of Naples Federico II, Italy; Prof. A. Castellazzi, Kyoto University of Advanced Science, Japan